Product Categories
►Semiconductors ▪ Damage Removal
Slice and Polish (Chemical Finishing)
At the early stages of silicon wafer manufacture, various
cleaning and chemical finishing operations
must be performed for removal of ionic
contamination, and for surface finishing
without adding ionic contamination.
Interlab’s all-plastic systems are designed
to maintain the utmost purity, while
cost-effectively processing high volumes of
wafers.
Systems using
ultrasonic
and megasonic cleaning, as well as caustic
and acid processes can take advantage of
Interlab’s high-purity hot DI water reclaim
systems and semiconductor-versions of our
evaporative dryer. Fully automatic processes
like that shown, deliver high volumes of
product with no human intervention.